Power chips are linked to outside circuits with product packaging, and their performance relies on the assistance of the packaging. In high-power scenarios, power chips are normally packaged as power components. Chip affiliation describes the electrical link on the upper surface area of the chip, which is normally aluminum bonding wire in conventional components. ^
Typical power module plan cross-section

Currently, commercial silicon carbide power components still mostly utilize the packaging technology of this wire-bonded traditional silicon IGBT component. They encounter troubles such as large high-frequency parasitical specifications, inadequate warmth dissipation capacity, low-temperature resistance, and not enough insulation toughness, which restrict the use of silicon carbide semiconductors. The display screen of excellent performance. In order to solve these issues and fully manipulate the big prospective advantages of silicon carbide chips, several brand-new packaging technologies and solutions for silicon carbide power components have arised in recent times.

Silicon carbide power component bonding method

(Figure (a) Wire bonding and (b) Cu Clip power module structure diagram (left) copper wire and (right) copper strip connection process)

Bonding products have created from gold cable bonding in 2001 to aluminum cable (tape) bonding in 2006, copper wire bonding in 2011, and Cu Clip bonding in 2016. Low-power tools have established from gold wires to copper wires, and the driving pressure is cost decrease; high-power devices have actually developed from aluminum wires (strips) to Cu Clips, and the driving pressure is to improve product efficiency. The greater the power, the higher the demands.

Cu Clip is copper strip, copper sheet. Clip Bond, or strip bonding, is a packaging procedure that utilizes a strong copper bridge soldered to solder to connect chips and pins. Compared to standard bonding product packaging methods, Cu Clip innovation has the adhering to benefits:

1. The connection between the chip and the pins is made of copper sheets, which, to a particular degree, replaces the conventional wire bonding technique in between the chip and the pins. Therefore, an unique package resistance value, higher present flow, and far better thermal conductivity can be acquired.

2. The lead pin welding location does not require to be silver-plated, which can completely save the cost of silver plating and inadequate silver plating.

3. The product appearance is totally consistent with normal products and is mostly made use of in servers, portable computer systems, batteries/drives, graphics cards, electric motors, power materials, and other fields.

Cu Clip has two bonding approaches.

All copper sheet bonding approach

Both the Gate pad and the Resource pad are clip-based. This bonding approach is more costly and complicated, yet it can attain better Rdson and better thermal results.

( copper strip)

Copper sheet plus cable bonding approach

The resource pad makes use of a Clip method, and eviction makes use of a Cord technique. This bonding technique is a little less expensive than the all-copper bonding technique, conserving wafer location (suitable to extremely tiny entrance areas). The process is less complex than the all-copper bonding approach and can get much better Rdson and much better thermal result.

Provider of Copper Strip

TRUNNANO is a supplier of surfactant with over 12 years experience in nano-building energy conservation and nanotechnology development. It accepts payment via Credit Card, T/T, West Union and Paypal. Trunnano will ship the goods to customers overseas through FedEx, DHL, by air, or by sea. If you are finding copper works, please feel free to contact us and send an inquiry.

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